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Gap Filler Pads (Low Compression Force)

Sarcon© GR-Sd and GR-SL are two of the lowest modulus type of Thermal Gap Filler Pad material available. Ideally suited for applications requiring low compression force on the component. It offers the high performance of the original GR-d and GR-L materials in a versatile sheet form that very easily conforms in and around protrusions and depressions on components to make complete, reliable physical contact.  

  • Absolute lowest modulus with highest adhesion
  • Easily fills air gaps, uneven surfaces
  • Lower thermal resistance due to complete surface contact
  • Low molecular silicone content in compliance with Bellcore specification TR-NWT00930

CONSTRUCTION

LowCompConstructionIllustration. 

APPLICATION GUIDE

LowCompApplicationIllustration 

AVAILABLE CONFIGURATIONS

Sheets, Die-cuts

APPLICATIONS

  • Semiconductors to heat sink 
  • Chassis walls to other surfaces
  • Components to heat spreader
  • CD-ROM, DVD-ROM cooling

UL FILE NUMBER

E58126

TYPICAL CHARACTERISTICS

Test Property Unit Measure Method
GR-Sd GR-SL
Thickness mm 2.5       5.0 2.5       5.0 -
Thermal Conductivity watt/m-k 1.4 2.9*  ASTM D5470
*ASTM D2326
Thermal Resistance °Cin2/W 1.72       2.33 1.43       1.95 ASTM D5470
Flame Retardancy UL94 V-1 V-1 UL94
Operating Temperature °C -60° to +200° -60° to +200° Fujipoly
Color Visual Gray Dark Gray -
Tensile Strength MPA 0.1 0.1 ASTM D412
Breakdown Voltage kV/mm 14 10 ASTM D149
Compression
(area = 25mm x 25mm)		 Kfg/in2 @ 10%
@50% sustain		 6.1       2.2
18.2       9.1		 2.0
20		 Fujipoly
Fujipoly

Low Pressure Nomenclature

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Technical Documents for Gap Filler Pads (Low Compression Force):

Sarcon GR-Sd And GR-SL Technical Information GR-d_SL.pdf (160 Kb)  Download 
New Product Technical Information

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